Back to top
  • You can now order in the EU!
  • Shop & shipment across the whole European Union.
In stock

GELID GC-4 Thermal Paste 3.5g – over 8.5W/mk* [TC-GC-04-B]


Density (g/cm3): 2.30
Net Content (g): 3.5
Thermal conductivity (W/mK): 8.5
Viscosity (Centipoise): 100000

60 months product warranty and 14-days return policy applies

In stock. Shipping time 1-2 business day.
SKU: TC-GC-04-B Category:

In stock

GC-4 Thermal Paste 3.5g (TC-GC-04-B)

The State-of-the-Art Thermal Compound

  • Ultimate Heat Conductivity
  • Non-Electrical Conductive Compound
  • Non-Corrosive, Non-Curing & Non-Toxic
  • No Bleeding & User Friendly
  • Built-in Dispenser
  • Net Content of 3.5g
  • Operating temperature range -30 to +150 degree Celsius

Created for professional and extreme users to provide the best thermal interface and to achieve ultra-efficient heat transfer from your CPU, GP and Chipset in mission critical applications.

GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.

Unleash the Full Overclocking Potential of Your CPU!

*According to some tests, the GC-4 performs much better than its older sibling, the GC-Extreme, or its competitor, the MX-4 thermal paste, which is known for its thermal conductivity of 8.5 W/mK.


Density (g/cm3): 2.30
Net Content (g): 3.5
Thermal conductivity (W/mK): 8.5
Viscosity (Centipoise): 100000

Density (g/cm3)


Net Content (g)


Thermal Conductivity (W/mK)


Viscosity (Centipoise)