GELID GC-4 Thermal Paste 3.5g – over 8.5W/mk* [TC-GC-04-B]

GC-4 Thermal Paste 3.5g (TC-GC-04-B)

The State-of-the-Art Thermal Compound

• Ultimate Heat Conductivity
• Non-Electrical Conductive Compound
• Non-Corrosive, Non-Curing & Non-Toxic
• No Bleeding & User Friendly
• Built-in Dispenser
• Net Content of 3.5g
• Operating temperature range -30 to +150 degree Celsius

Created for professional and extreme users to provide the best thermal interface and to achieve ultra-efficient heat transfer from your CPU, GP and Chipset in mission critical applications.

GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.

Unleash the Full Overclocking Potential of Your CPU!

*According to some tests, the GC-4 performs much better than its older sibling, the GC-Extreme, or its competitor, the MX-4 thermal paste, which is known for its thermal conductivity of 8.5 W/mK.

Specifications:

Density (g/cm3): 2.30
Net Content (g): 3.5
Thermal conductivity (W/mK): 8.5
Viscosity (Centipoise): 100000